Note: The job is a remote job and is open to candidates in USA. NVIDIA is a leading technology company focused on harnessing the potential of AI to revolutionize computing. The role involves driving technology across multiple functions, with responsibilities including defining and implementing chip pad rings and collaborating with various engineering teams.
Responsibilities
- Your responsibilities include defining and implementing the chip pad ring, substrate interconnect scheme, and lead the package layout design process
- We collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and Managers
- Work to define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package!
- Communicate effectively with various teams throughout the company
Skills
- BSEE or equivalent experience
- Minimum of 8+ years in board/system design
- Good understanding of transmission line theory, power delivery and signal integrity
- Hardworking and able to work with a minimum of supervision
- You seek to solve complex technical problems
- Experience with package design
- Programming and scripting skills in Perl, Python, Tcl
- Cadence Skill and EXCEL familiarity
Benefits
- Equity
- A comprehensive benefits package
Company Overview
NVIDIA is a computing platform company operating at the intersection of graphics, HPC, and AI. It was founded in 1993, and is headquartered in Santa Clara, California, USA, with a workforce of 10001+ employees. Its website is https://www.nvidia.com.Company H1B Sponsorship
NVIDIA has a track record of offering H1B sponsorships, with 448 in 2026, 1872 in 2025, 1354 in 2024, 976 in 2023, 835 in 2022, 601 in 2021, 529 in 2020. Please note that this does not guarantee sponsorship for this specific role.